TIET Newsletter
Mar 2018

In this Issue
  • Insulating bricks with microscopic bubbles – opening up new architectural possibilities
  • Researchers develop heat switch for electronics
  • TIET Updates

Insulating bricks with microscopic bubbles – opening up new architectural possibilities

Traditionally, the insulating layers are applied to the finished walls. Increasingly, however, self-insulating bricks are being used –– saving both work steps and costs and opening up new architectural possibilities. Insulating bricks offer a workable compromise between mechanical and thermal properties and are also suited for multi-storey buildings. They are already available on the market in numerous models: some have multiple air-filled chambers, others have larger cavities filled with insulating materials such as pearlite, mineral wool or polystyrene. Their thermal conductivity values differ depending on the structure and filling material. In order to reach the insulation values of walls with seperate insulating layers, the insulating bricks are usually considerably thicker than normal bricks.

The researchers have now replaced Perlite in insulating bricks with Aerogel: a highly porous solid with very high thermal insulation properties that can withstand temperatures of up to 300°C. A comparison in a special measuring device for thermal conductivity at an average temperature of 10°C shows that the perlite-filled bricks with the same structure and thickness insulate by about a third less than the aerobrick. Even more impressive is the comparison with ordinary brickwork made of non-insulating bricks: These conduct heat up to eight times better. A conventional wall would therefore have to be almost two metres deep in order to insulate as well as an aerobricks wall of just 20 centimetres in depth.

Aerogels are a relatively new development as insulating materials in the building sector. The base for the material are mostly silicates, but in volume it consists of more than 90% of air-filled pores with sizes in the nano range. This minimizes the energy transfer through the movement of the air molecules –– in other words, aerogels are highly efficient insulating materials. In addition to its thermal properties, aerogels are vapour permeable, absorb almost no moisture, recyclable, non-toxic and non-combustible. This makes it an almost ideal thermal insulation material for buildings.

Researchers develop heat switch for electronics
Researchers at the University of Illinois at Urbana–Champaign have developed a new technology for switching heat flows 'on' or 'off'. The findings were published in the article "Millimeter-scale liquid metal droplet thermal switch," which appeared in Applied Physics Letters. Switches are used to control many technical products and engineered systems. Mechanical switches are used to lock or unlock doors, or to select gears in a car's transmission system. Electrical switches are used to turn on and off the lights in a room. At a smaller scale, electrical switches in the form of transistors are used to turn electronic devices on and off, or to route logic signals within a circuit.

Engineers have long desired a switch for heat flows, especially in electronics systems where controlling heat flows can significantly improve system performance and reliability. There are however significant challenges in creating such a heat switch.

"Heat flow occurs whenever you have a region of higher temperature near a region of lower temperature," said William King, the Andersen Chair Professor in the Department of Mechanical Science and Engineering and the project co-leader. "In order to control the heat flow, we engineered a specific heat flow path between the hot region and cold region, and then created a way to break the heat flow path when desired." "The technology is based on the motion of a liquid metal droplet," said Nenad Miljkovic, Assistant Professor in the Department of Mechanical Science and Engineering and the project co-leader. "The metal droplet can be positioned to connect a heat flow path, or moved away from the heat flow path in order to limit the heat flow." The researchers demonstrated the technology in a system modeled after modern electronics systems. On one side of the switch there was a heat source representing the power electronics component, and on the other side of the switch, there was liquid cooling for heat removal. When the switch was on, they were able to extract heat at more than 10 W/cm2. When the switch was off, the heat flow dropped by nearly 100X.
  • TIET conducted a workshop onAutoCAD at World Institute of Technology, Gurugram, Haryana.

  • Keeping in view the demand, TIET has created new courses on BIM and its allied technologies.

  • TIET conducted a workshop at World College of Technology and Management, Gurugram, Haryana, on AutoCAD.

  • ​​With the objective of spreading awareness on latest technologies and their industry applications, TIET will​ conduct a session on ​SolidCAM and related technologies on 17th March. Many industry experts and professionals will join the event and share their views on industrial applicability of these technologies.

  • IET has signed MOU with CADDesk and CADPoint.

Textbook Overvieww
CADCIM Technologies publishes textbooks on Computer Aided Design, Manufacturing, and Engineering (CAD/CAM/CAE), Civil, GIS, Animation, and Computer Programming software... More

New Releases
CADCIM announces the release of Mold Design using NX 11.0: A Tutorial Approach; Solid Edge ST10 for Designers, 15th Edition; NX 12.0 for Designers, 11th Edition; SOLIDWORKS 2018 for Designers, 16th Edition; Introducing PHP/MySQL; Exploring Autodesk Revit 2018 for MEP; Autodesk Maya 2018: A Comprehensive Guide, 10th Edition; Creo Parametric 4.0 for Designers;  AutoCAD Plant 3D 2018 for Designers, 4th Edition; AutoCAD Electrical 2018 for Electrical Control Designers, 9th Edition; Autodesk 3ds Max 2018: A Comprehensive Guide, 18th Edition; Autodesk 3ds Max 2018 for Beginners: A Tutorial Approach, 18th Edition; Exploring AutoCAD Map 3D 2018, 8th Edition; Autodesk Inventor Professional 2018 for Designers, 18th Edition...More

Upcoming Textbooks
Our team of authors is currently working on the new and latest releases of various software packages and will soon come up with Blender 2.79 for Digital Artists; Fusion 360: A Tutorial Approach; SolidCAM 2016: A Tutorial Approach; AutoCAD 2019: A Problem Solving-Approach, Basic and Intermediate, 25th Edition; Autodesk Inventor Professional 2019 for Designers, 19th Edition; Exploring Autodesk Revit 2019 for MEP, 6th Edition; Autodesk Maya 2019: A Comprehensive Guide, 11th Edition... More

***The news items contained in this newsletter have been compiled from various publications and restructured to make our readers familiar with emerging technologies. TIET does not claim any copyright of these items.

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