TIET Newsletter
Nov 2017

In this Issue
  • 3-D Origami Circuits Could Revolutionize Electronic Designs
  • Electronic Pills - Collecting Data Inside the Body
  • Cool Textiles to Beat the Heat
  • TIET Updates

3–D Origami Circuits Could Revolutionize Electronic Designs

Creative Origami, the well–known Japanese art of paper folding, generates complex 3–D structures from flat 2–D paper. While the creation of a paper swan may be intriguing, the idea of creating 3–D circuits based on similar design principles is simply mindboggling. This science fiction-sounding research is a project that Jiwoong Park and colleagues from the University of Chicago have been developing over the last few years. Park's focus on large scale synthesis and device fabrication using ultra–thin materials has led to improvements in 2–D models and the introduction of 3–D vertically integrated devices.

Using atomically thin materials, Park synthesizes large scale integrated circuits that can be stitched together laterally to form a 2–D module. Combining various ultra–thin building blocks also allows for the integration of different electric and thermal properties within the same circuit, exponentially increasing functionality. The use of these ultra–thin materials, as opposed to typical components and resources, allows for a smaller circuit, but surprisingly not difficult to manipulate. The 2–D ingredients are assembled in such a way that they can be viewed with a simple optical microscope or even with naked eye and can be handled accordingly.

Electronic Pills - Collecting Data Inside the Body
After years of investment and development, wireless devices contained in swallowable capsules are now reaching the market.

Israel–based Given Imaging and the researchers at the University of Buffalo in New York have developed ingestible capsules that record data from inside your body. These pills contain sensors or tiny cameras that collect information as they travel through the gastrointestinal tract before being excreted from the body a day or two later. These new electronic inventions transmit information such as acidity, pressure and temperature levels or images of the esophagus and intestine to your doctor's computer for analysis. Doctors often use invasive methods such as catheters, endoscopic instruments or radioisotopes for collecting information about the digestive tract. So device companies have been developing easier, less intrusive ways, to gather information. "One of the main challenges is determining just what is happening in the stomach and intestines." says Dr. Anish A. Sheth, Director of the Gastrointestinal Motility Program at Yale-New Haven Hospital. Electronic pills are being used to measure muscle contraction, ease of passage and other factors to reveal information unavailable in the past.

Cool Textiles to Beat the Heat
Scientists have developed a 3–D printable fiber for clothes that can cool you down. Air–conditioned buildings bring welcome relief to people coming in from the heat. But creating that comfort comes with a cost to our wallets and the environment in the form of increased energy bills and greenhouse gas emissions. Now researchers report in ACS Nano the development of a new material for clothing that we could one day don as our own personal cooling unit, without any external energy needed to power it.

Liangbing Hu and colleagues at University of Maryland College Park wanted to see if they could come up with a more practical option. The researchers combined boron nitride—a material that transfers heat—and polyvinyl alcohol to create a nanocomposite fiber that can be 3–D printed and woven into fabric. Testing to simulate the material on skin showed that the composite is 1.5 to 2 times more efficient at moving heat away from the body when compared to pure polyvinyl alcohol or cotton fabrics, respectively. Making clothes with the nanocomposite thread could help keep wearers comfortable and reduce the need to cool entire buildings, the researchers say.


  • TIET conducted a seminar in DPGITM on latest emerging technologies in Civil and Mechanical engineering fields.

  • TIET conducted a quiz contest, TechQuest, in DPGITM, Gurgaon with the objective of providing them the opportunity to assess themselves on familiarity to latest emerging technologies in science and technology area.

  • TIET provided training on SOLIDWORKS and AutoCAD to Mechanical engineering students and training on Revit and AutoCAD to Civil engineering students of Saint Andrews Institute of Technology and Management (SAITM), Gurgaon.

  • TIET provided training on Arc GIS to the employees of G-ENG Advisory.

Textbook Overvieww
CADCIM Technologies publishes textbooks on Computer Aided Design, Manufacturing, and Engineering (CAD/CAM/CAE), Civil, GIS, Animation, and Computer Programming software... More


New Releases
CADCIM announces the release of Exploring Autodesk Revit 2018 for MEP; Autodesk Maya 2018: A Comprehensive Guide, 10th Edition; Creo Parametric 4.0 for Designers;  AutoCAD Plant 3D 2018 for Designers, 4th Edition; AutoCAD Electrical 2018 for Electrical Control Designers, 9th Edition; Autodesk 3ds Max 2018: A Comprehensive Guide, 18th Edition; Autodesk 3ds Max 2018 for Beginners: A Tutorial Approach, 18th Edition; Exploring AutoCAD Map 3D 2018, 8th Edition; Autodesk Inventor Professional 2018 for Designers, 18th Edition...More

Upcoming Textbooks
Our team of authors is currently working on the new and latest releases of various software packages and will soon come up with Mold Design using NX 11.0: A Tutorial Approach;  Fusion 360: A Tutorial Approach; SolidCAM 2016: A Tutorial Approach; Solid Edge ST10 for Designers, 15th Edition; NX 12.0 for Designers, 11th Edition; SOLIDWORKS 2018 for Designers, 16th Edition; Introducing PHP/MySQL... More

***The news items contained in this newsletter have been compiled from various publications and restructured to make our readers familiar with emerging technologies. TIET does not claim any copyright of these items.

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