TIET Newsletter
July 2018

In this Issue
  • 3–D Metal Printing
  • Sensing City
  • Materials' Quantum Leap
  • TIET Updates

3–D Metal Printing

3–D printing has been around for decades, but it has largely remained in the domain of designers creating prototypes with plastic. Creating anything other than plastics, in particular metal, has been expensive and painfully slow. Now, however, it's becoming cheap and easy enough to be a potentially practical way of manufacturing parts. If widely adopted, it could change the way we mass-produce many products.
The technology can create lighter, stronger parts, and complex shapes that aren't possible with conventional metal fabrication methods. It can also provide more precise control of the microstructure of metals. In 2017, researchers from the Lawrence Livermore National Laboratory announced they had developed a 3–D printing method for creating stainless-steel parts twice as strong as traditionally made ones. Similarly some other companies like MarkForged and DeskTop Metals, have also introduced 3–D printinters that can that are 100 times faster than older printing methods.

Sensing City
Numerous smart–city schemes have run into delays, dialed down their ambitious goals, or priced out everyone except the super–wealthy. A new project in Toronto, called Quayside, is hoping to change that pattern of failures by rethinking an urban neighborhood from the ground up and rebuilding it around the latest digital technologies.
Alphabet's Sidewalk Labs, based in New York City, is collaborating with the Canadian government on the high–tech project, slated for Toronto's industrial waterfront. One of the project's goals is to base decisions about design, policy, and technology on information from an extensive network of sensors that gather data on everything from air quality to noise levels to people's activities. One of the project's goals is to base decisions about design, policy, and technology on information from an extensive network of sensors that gather data on everything from air quality to noise levels to people's activities. The plan calls for all vehicles to be autonomous and shared. Robots will roam underground doing menial chores like delivering the mail. Sidewalk Labs says it will open access to the software and systems it's creating so other companies can build services on top of them, much as people build apps for mobile phones.

Materials' Quantum Leap
Quantum computers promise to run calculations far beyond the reach of any conventional supercomputer. They might revolutionize the discovery of new materials by making it possible to simulate the behavior of matter down to the atomic level. Or they could upend cryptography and security by cracking otherwise invincible codes. There is even hope they will supercharge artificial intelligence by crunching through data more efficiently.
Now with the help of quantum computers chemists would be able to crete new proteins for far more effective drugs, novel electrolytes for better batteries, compounds that could turn sunlight directly into a liquid fuel, and much more efficient solar cells. Also, it will become possible to accurately simulate far larger and more interesting molecules as scientists build machines with more qubits and, just as important, better quantum algorithms.
  • IET, in a terms with Dassault Systemes, has agreed to offer CATIA course to its partners at an affordable price.

  • TIET is offering some of its best selling courses at a scholarship upto 50 percent till August 31, 2019.

  • IET, in a terms with Graebert CAD, has agreed to offer software to its partners at an affordable price.

  • IET, in a terms with NANOCAD, has agreed to offer software to its partners at an affordable price.

  • Bentley, in association with Innovative Systems, is conducting a Rountable Conference at Mariot, Chandigarh on August 1, 2018

Textbook Overvieww
CADCIM Technologies publishes textbooks on Computer Aided Design, Manufacturing, and Engineering (CAD/CAM/CAE), Civil, GIS, Animation, and Computer Programming software... More



New Releases
CADCIM announces the release of  Learning SOLIDWORKS 2018: A Project Based Approach; Autodesk 3ds Max 2019: A Comprehensive Guide, 19th Edition;  Exploring Autodesk Revit 2019 for MEP, 6th Edition; Creo Parametric 5.0 for Designers, 5th Edition; Autodesk Inventor Professional 2019 for Designers, 19th Edition; AutoCAD 2019: A Problem-Solving Approach, Basic and Intermediate, 25th Edition; Exploring Autodesk Revit 2019 for Structure, 9th Edition; Exploring Autodesk Revit 2019 for Architecture, 15th Edition; Blender 2.79 for Digital Artists; Autodesk Fusion 360: A Tutorial Approach; Solid Edge ST10 for Designers, 15th Edition; NX 12.0 for Designers, 11th Edition; SOLIDWORKS 2018 for Designers, 16th Edition; Introducing PHP/MySQL...More


Upcoming Textbooks
Our team of authors is currently working on the new and latest releases of various software packages and will soon come up with Autodesk Maya 2019: A Comprehensive Guide, 11th Edition;  SOLIDWORKS 2019 for Designers, 17th Edition; Solid Edge 2019 for Designers, 16th Edition; Exploring ETabs 2016;  Modo 10 for Digital Artists... More

***The news items contained in this newsletter have been compiled from various publications and restructured to make our readers familiar with emerging technologies. TIET does not claim any copyright of these items.

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