TIET Newsletter
Aug 2019

In this Issue
  • Researchers 3D-Print Transparent Glass
  • Engineers Make Transistors And Electronic Devices Entirely From Thread
  • TIET Updates

Researchers 3D-Print Transparent Glass

Over the years, 3D printing technology has grown to a large extent and now a wide variety of materials including plastics and metals have been getting printed through this technology. Now MIT researchers have developed and perfected a process to 3D print the optically transparent glass objects. The major obstacle so far in producing glass objects has been the extremely high temperature needed to melt the material.

The system developed by MIT team to produce 3D printed glass objects, called G3DP2, retains high temperature and thus the properties that are both strong and fully transparent to light. Like other 3-D printers now on the market, the device can print designs created in a computer-assisted design program, producing a finished product with little human intervention. In this system, molten glass is loaded into a hopper in the top of the device after being gathered from a conventional glassblowing kiln. When completed, the finished piece must be cut away from the moving platform on which it is assembled. In operation, the device's hopper, and a nozzle through which the glass is extruded to form an object, are maintained at temperatures of about 1,900 degrees Fahrenheit, far higher than the temperatures used for other 3-D printing. The stream of glowing molten glass from the nozzle resembles honey as it coils onto a platform, cooling and hardening as it goes.

Engineers Make Transistors And Electronic Devices Entirely From Thread
A team of engineers has developed a transistor made from linen thread, enabling them to create electronic devices made entirely of thin threads that could be woven into fabric, worn on the skin, or even (theoretically) implanted surgically for diagnostic monitoring. The fully flexible electronic devices could enable a wide range of applications that conform to different shapes and allow free movement without compromising function, the researchers say.

In a study published in ACS Applied Materials and Interfaces, the authors describe engineering the first thread-based transistors (TBTs) which can be fashioned into simple, all-thread based logic circuits and integrated circuits. The circuits replace the last remaining rigid component of many current flexible devices, and when combined with thread-based sensors, enable the creation of completely flexible, multiplexed devices. The field of flexible electronics is expanding rapidly, with most devices achieving flexibility by patterning metals and semiconductors into bendable "wavy" structures or using intrinsically flexible materials such as conducting polymers. These "soft" electronics are enabling applications for devices that conform and stretch with the biological tissue in which they are embedded, such as skin, heart or even brain tissue.

However, compared to electronics based on polymers and other flexible materials, thread-based electronics have superior flexibility, material diversity, and the ability to be manufactured without the need for cleanrooms, the researchers say. The thread-based electronics can include diagnostic devices that are extremely thin, soft and flexible enough to integrate seamlessly with the biological tissues that they are measuring. The Tufts engineers previously developed a suite of thread-based temperature, glucose, strain, and optical sensors, as well as microfluidic threads that can draw in samples from, or dispense drugs to, the surrounding tissue. The thread-based transistors developed in this study allow the creation of logic circuits that control the behavior and response of those components. The authors created a simple small-scale integrated circuit called a multiplexer (MUX) and connected it to a thread-based sensor array capable of detecting sodium and ammonium ions -- important biomarkers for cardiovascular health, liver and kidney function.
  • TIET did a GIS Project for ADB.

  • TIET provided Online Training on ANSYS.

  • TIET provided training on BIM.

Textbook Overvieww
CADCIM Technologies publishes textbooks on Computer Aided Design, Manufacturing, and Engineering (CAD/CAM/CAE), Civil, GIS, Animation, and Computer Programming software... More

New Releases
CADCIM announces the release of AutoCAD MEP 2020 for Designers, 5th Edition; Siemens NX 2019 for Designers, 12th Edition; Exploring Autodesk Revit 2020 for Architecture, 16th Edition; Autodesk Maya 2019: A Comprehensive Guide, 11th Edition; AutoCAD 2020: A Problem-Solving-Approach, Basic and Intermediate, 26th Edition; Autodesk Inventor Professional 2020 for Designers, 20th Edition; Exploring Autodesk Navisworks 2019, 5th Edition; Pixologic ZBrush 2018: A Comprehensive Guide; Exploring AutoCAD Civil 3D 2019, 9th Edition; Exploring Oracle Primavera P6 Professional 18, 3rd Edition; Solid Edge 2019 for Designers, 16th Edition; SOLIDWORKS 2019 for Designers, 17th Edition; CATIA V5-6R2018 for Designers, 16th Edition; Learning SOLIDWORKS 2018: A Project Based Approach; Autodesk 3ds Max 2019: A Comprehensive Guide, 19th Edition; Exploring Autodesk Revit 2019 for MEP, 6th Edition; Creo Parametric 5.0 for Designers, 5th Edition; Exploring Autodesk Revit 2019 for Structure, 9th Edition... More

Upcoming Textbooks
Our team of authors is currently working on the new and latest releases of various software packages and will soon come up with  Exploring Autodesk Revit 2020 for MEP, 7th Edition; Exploring Autodesk Revit 2020 for Structure, 10th Edition;  Autodesk 3ds Max 2020: A Comprehensive Guide, 20th Edition;  AutoCAD Plant 3D 2020 for Designers, 5th Edition; Exploring Autodesk Revit 2020 for MEP, 7th Edition... More

***The news items contained in this newsletter have been compiled from various publications and restructured to make our readers familiar with emerging technologies. TIET does not claim any copyright of these items.

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