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TIET Newsletter

TIET Newsletter
Feb 2021

In this Issue
  • Researchers Develop Programming Technology to Transform 2D-Materials into 3D-Shapes
  • Engineers Review Advancements in the Development of Stretchable Transistors
  • TIET Updates

Researchers Develop Programming Technology to Transform 2D-Materials into 3D-Shapes

The University of Texas at Arlington researchers have developed a technique that programs 2D materials to transform into complex 3D shapes. It allows the team to print 2D materials encoded with spatially controlled in-plane growth or contraction that can result into programmed 3D structures.


2D-printing process can simultaneously print multiple 2D materials encoded with individually customized designs and transform them on demand and in parallel to programmed 3D structures. From a technological point of view, this approach is scalable, customizable, and deployable, and it can potentially complement existing 3D-printing methods. Using this method and a desktop 3D scanner, the research team were able to successfully print several parts including the model of an automobile, shown in the picture above.

Engineers Review Advancements in the Development of Stretchable Transistors
Transistors will be central to the development of stretchable electronics, serving as the building-block elements in circuits for signal processing and computation. Imparting stretchability to transistors and then functional circuits is thus a key goal in achieving fully functional stretchable electronics With this in mind, researchers at the University of Chicago and Argonne National Laboratory wrote a review paper delineating the most common strategies used to develop stretchable transistors and the results achieved so far. Three general and common approaches to realize stretchable transistors. (i) Buckling engineering; (ii) Stiffness engineering; (iii) Intrinsic stretchability engineering.

Stretchable transistors are typically made of inherently flexible materials. This means that they can generally be fabricated simply by incorporating a number of flexible structures without the need for specially designed strain-dissipation structures. To fabricate electronics with more sophisticated capabilities, researchers typically use arrays of transistors.
  • TIET provided consultancy services to an overseas client and executed creation of 100 families of bathroom fittings.

  • TIET provided training on BIM services - Level 2 to one of its corporate clients in India.

  • TIET delivered training of Rhino to international students.

  • CADCIM released new courses on GIS and BIM on Udemy.

Textbook Overview
CADCIM Technologies publishes textbooks on Computer Aided Design, Manufacturing, and Engineering (CAD/CAM/CAE), Civil, GIS, Animation, and Computer Programming software... More

New Releases
CADCIM announces the release of SOLIDWORKS 2021 for Designers, 19th Edition; Exploring Autodesk Navisworks 2021, 7th Edition; Exploring Autodesk Revit 2021 for MEP, 7thEdition; Autodesk 3ds Max 2021 for Beginners: A Tutorial Approach, 21st Edition; Creo Parametric 7.0 for Designers, 7th Edition; AutoCAD Electrical 2021: A Tutorial Approach , 2nd Edition; SOLIDWORKS 2020: A Tutorial Approach, 5th Edition; AutoCAD Plant 3D 2021 for Designers, 6th Edition; Exploring Autodesk Revit 2021 for Structure, 11th Edition; AutoCAD Electrical 2021 for Electrical Control Designers, 12th Edition; Autodesk 3ds Max 2021: A Comprehensive Guide, 21st Edition; Siemens NX 2020 for Designers, 13th Edition; Exploring Autodesk Revit 2021 for Architecture, 17th Edition; Autodesk Maya 2020: A Comprehensive Guide, 12th Edition; AutoCAD 2021: A Problem-Solving-Approach, Basic and Intermediate, 27th Edition; Autodesk Inventor Professional 2021 for Designers, 21st Edition ... More

Upcoming Textbooks
Our team of authors is currently working on the new and latest releases of various software packages and will soon come up with Solid Edge 2021 for Designers, 18th Edition... More

***The news items contained in this newsletter have been compiled from various publications and restructured to make our readers familiar with emerging technologies. TIET does not claim any copyright of these items.

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